JPS6024536Y2 - 研削砥石 - Google Patents
研削砥石Info
- Publication number
- JPS6024536Y2 JPS6024536Y2 JP8420976U JP8420976U JPS6024536Y2 JP S6024536 Y2 JPS6024536 Y2 JP S6024536Y2 JP 8420976 U JP8420976 U JP 8420976U JP 8420976 U JP8420976 U JP 8420976U JP S6024536 Y2 JPS6024536 Y2 JP S6024536Y2
- Authority
- JP
- Japan
- Prior art keywords
- small
- grinding wheel
- vitrified
- diameter
- base layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229920003002 synthetic resin Polymers 0.000 claims description 11
- 239000000057 synthetic resin Substances 0.000 claims description 11
- 239000006061 abrasive grain Substances 0.000 claims description 9
- 229910052582 BN Inorganic materials 0.000 claims description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- 238000010304 firing Methods 0.000 description 6
- 239000010419 fine particle Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011146 organic particle Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8420976U JPS6024536Y2 (ja) | 1976-06-25 | 1976-06-25 | 研削砥石 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8420976U JPS6024536Y2 (ja) | 1976-06-25 | 1976-06-25 | 研削砥石 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS532086U JPS532086U (en]) | 1978-01-10 |
JPS6024536Y2 true JPS6024536Y2 (ja) | 1985-07-22 |
Family
ID=28566128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8420976U Expired JPS6024536Y2 (ja) | 1976-06-25 | 1976-06-25 | 研削砥石 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6024536Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5670837U (en]) * | 1979-11-07 | 1981-06-11 |
-
1976
- 1976-06-25 JP JP8420976U patent/JPS6024536Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS532086U (en]) | 1978-01-10 |
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